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HCM010SEAAMD-0P - Quectel MCU Bluetooth Module

HCM010SEAAMD-0P - Quectel MCU Bluetooth Module

£3.64
Quectel HCM010SEAAMD-0P is a high-performance MCU Bluetooth LE 5.4 module (HCM010S-E)
  • LCC form factor - 20.0mm × 15.6mm × 2.4mm
  • Weight - 1.14g
  • Operating temperature of -40°C to +105°C
Expected delivery time
Manufacturer lead time - 15 weeks
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Product Details

HCM010S-E Overview

HCM010S-E is a high-performance MCU Bluetooth module launched by Quectel. It boasts a ARM Cortex-M33 processor with a frequency of up to 80 MHz, and supports BLE 5.4 and BLE Mesh. The module features built-in 64 KB SRAM and 768 KB flash, ensuring efficient performance.

HCM010S-E is in a LCC + DIP form factor with an ultra-compact size of 20.0 mm × 15.6 mm × 2.4 mm, which optimises the size and cost for end-products and is compatible with diverse designs.

HCM010S-E supports up to 18 GPIOs for I2C, UART, SPI, I2S and other functions, features an superior sensitivity of -104 dBm and transmit power of up to +20 dBm and Bluetooth low power mode, which provide flexibility and versatility for a range of applications.

HCM010S-E supports standard Bluetooth mesh networking, increasing network scalability and node counts with mesh topology, which is suitable for BLE devices that enables many-to-many communications, smart lighting, smart buildings and home smart wireless networks. And the module offers an enhanced security option, Secure Vault, featuring a higher level of IoT security.

HCM010S-E Key features

  • BLE 5.4
  • 64 KB SRAM and 768 KB flash
  • Bluetooth Low Energy Mesh networking
  • 18 GPIOs which can be multiplexed for various interfaces including I2C, UART, SPI, I2S functions
  • Operating temperature range: -40°C to +105°C
  • PCB antenna (HCM010SEAAMD-0P)

Packaging: Reel (Quantities of 1000. MOQ = 3000) 
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