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HCM010SAAMD-0P - Quectel MCU Bluetooth module

HCM010SAAMD-0P - Quectel MCU Bluetooth module

£3.20
Quectel HCM010SAAMD-0P is a MCU Bluetooth LE 5.4 module (HCM010S):
  • LCC + DIP form factor - 20.0mm × 15.6mm × 2.4mm
  • Weight - 1.14 g
  • Operating temperature of -40 °C to +105 °C
Expected delivery time
Manufacturer lead time - 15 weeks
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Product Details

HCM010S Overview

HCM010S is a high-performance MCU Bluetooth module launched by Quectel. It boasts an ARM Cortex-M33 processor with a frequency of up to 80 MHz, and supports BLE 5.4 and BLE Mesh. The module features built-in 64KB SRAM and 768KB flash, ensuring efficient performance. HCM010S is in a LCC + DIP form factor with an ultra-compact size of 20.0mm × 15.6mm × 2.4mm, which optimizes the size and cost for end-products and is compatible with diverse designs.

HCM010S supports up to 20 GPIOs for UART, SPI, I2C and other functions in QuecOpen® solution, features superior sensitivity of -104 dBm and transmit power of up to +20 dBm and Bluetooth low power mode, which provide flexibility and versatility for a range of applications.

HCM010S supports standard Bluetooth mesh networking, increasing network scalability and node counts with mesh topology, which is suitable for BLE devices that enables many-to-many communications, smart lighting, smart buildings and home smart wireless networks. And the module offers an enhanced security option, Secure Vault, featuring a higher level of IoT security.

HCM010S Key features

  • BLE 5.4
  • 64KB SRAM and 768KB flash
  • Bluetooth mesh networking
  • 20 GPIOs for I2C, UART, SPI, I2S functions in QuecOpen® solution
  • Operating temperature range: -40°C to +105°C
  • PCB antenna

Packaging: Reel (Quantities of 1000. MOQ = 3000)
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