QCC-7226-1-PSP244-HR-03-0 - Qualcomm QCC7226 audio SoC
QCC-7226-1-PSP244-HR-03-0 (S7 Sound Platform)
2.0 128Mb STK 2.4GHz BT, Apps, Sensor/Context Proc Hub, Dual DSP, NNU, Low Lat DSP, Root of trust & security services, PMU, Codec (4xADC)
This is the small tape & reel (HR) variant of this chip, with an order quantity of 100 per package. If you would prefer larger volumes, the following larger reels & tray packaging are available. Please contact us on +44 1256 818111 for a quote and to place your order:
- QCC-7226-1-PSP244-SR-03-0 - 500 per reel
- QCC-7226-1-PSP244-TR-03-0 - 4000 per reel
- QCC-7226-1-PSP244-HR-03-0 - tray
We also sell the relevant development board and development kit.
£13.33
Additional information
Data Sheet/Product Brief
https://bcdatlantik.co.uk//bcd-assets/specsheets/qualcomm_s7_sound_platform_product_brief.pdfAvailable Offer
Product Details
Qualcomm S7 Sound Platform
The Qualcomm S7 and S7 Pro Gen 1 Sound are our most advanced audio platforms ever. They deliver 6 times more compute power, and almost 100 times the AI power of previous generation platforms. They have been designed to deliver a new premium tier of performance unlike anything listeners have heard before.
These platforms deliver an unparalleled level of on-device AI and premium audio technologies including Qualcomm® 4th Generation Active Noise Cancellation (ANC), Hearing Loss Compensation and personal sound amplification, which work together to deliver personalized and responsive sound experiences.
The S7 Pro Sound platform is the first to support revolutionary new Qualcomm XPAN® technology along with micro-power Wi-Fi connectivity to deliver breakthrough audio range and quality.
Next level audio performance
A completely new architecture provides powerful compute, with almost 100x more on-device AI, 3x more memory, and significantly more DSP power, to help ignite a new era of audio innovation.
On-device AI
Powerful on-device AI maximizes audio performance and enhances the user experience for many different use cases. The data is processed locally on device for security and peace of mind, and enhanced power management ensures that you get the best performance and experience from your device, with no compromise on battery life.
Immersive sound
Qualcomm® 4th Generation Active Noise Cancellation and all-new hardware architecture supports low-latency, multi-channel and low-power active noise cancellation. For the user this means our strongest ever ANC performance, regardless of variations in earbud fit, resulting in a consistent ANC experience for all users. Advanced Adaptive Transparency mode is also supported for situations when users need to be aware of what is going on around them. ANC transitions seamlessly with Hearing Loss Compensation and personal sound amplification technologies so users can focus on what’s important to them, staying connected with family, friends and colleagues even in extremely noisy environments.
Untethered audio experiences
With Qualcomm XPAN technology devices are designed to seamlessly switch from a direct connection to your phone, or laptop, instead connecting via Wi-Fi access points when out of Bluetooth range, staying connected via Wi-Fi as you walk around your home, building or campus, whether you are listening to music or making calls.
Enhanced sound
With Snapdragon Sound and Qualcomm XPAN technology, up to 192kHz lossless music streaming can be delivered over micro-power Wi-Fi, so listeners can hear every detail of their music in stunning audiophile quality. The micro-power Wi-Fi and XPAN technology will also deliver unprecedented bandwidth at low latency, which combined with AI-driven sensor compute capabilities, enable a step change in head-tracking latency for unparalleled immersive spatial experiences.
Wi-Fi connectivity at micro-power
The Qualcomm S7 Sound Pro Platform includes a world-class Wi-Fi solution that works alongside Qualcomm XPAN technology to extend the capability and range of audio devices far beyond what is possible with only Bluetooth, whilst maintaining the ultra-low power performance we have come to expect from earbuds and headsets.
Qualcomm S7 Sound Platform Features
- All new platform architecture unlocks a new tier of performance at ultra-low power
- Almost 100 times more AI compute power than the Qualcomm S5 Gen 2 Sound Platform
- 3x more memory than the Qualcomm S5 Gen 2 Sound Platform
- A step-change in DSP – 1.5GHz total audio compute (50%+ improvement on previous Qualcomm S5 Gen 2 Sound Platform)
- Dedicated AI core - to provide higher performance and lower power for ML applications compared to using the DSP
- Dedicated cores for audio curation including hearing loss compensation, ANC, transparency and noise management
- Qualcomm® 4th Generation Adaptive Active Noise Cancellation 112 biQuad filters combined with fully programmable 3uSec low latency DSP to enable personalized and responsive audio curation
- HiFi-grade stereo audio codec
- Bluetooth 5.4 radio
- Bluetooth® LE Audio experiences, including Auracast™ Broadcast Audio
- High-performance audio combined with low-power consumption, designed for Snapdragon Sound
- USB High Speed PHY at 480 Mbps which unlocks enhanced Audio Development workflows
- Non-invasive low-level debug through use of Qualcomm USB-EUD
- Enhanced memory and peripheral data sharing across subsystems for lower latency, higher throughputs
- DMIC, I2S, TDM, Soundwire digital audio interfaces
- Fully integrated system including PMU, Charger, mic bias, and external supply support
- Integrated Flash - Qualcomm QCC7726 includes 128Mb integrated flash and Qualcomm QCC7228 incudes 265Mb
Qualcomm® S7 Pro Gen 1 additional features
- Wi-Fi connectivity at micro-power
- Support for Qualcomm XPAN for whole home and building coverage
- Seamless transitions to Wi-Fi from Bluetooth
- Data rates of up to 29Mpbs, supporting Snapdragon Sound and delivering up to 24-bit 192kHz lossless music streaming over Wi-Fi
- The Qualcomm QCP7321 micro power Wi-Fi device partners alongside either the QCC7226 or QCC7228
