



A6T4GF3SACA-HP Zentel SODIMM 4GB, 1R x8 DDR3 Module
£34.40
A6T4GF3SACA-HP
4GB, 1Rx8 204-Pin DDR3L-1866 SODIMM, Row-Hammer free
Industry-first cyber-resilient DDR3L SODIMM DRAM Module
Data Sheet/Product Brief
https://bcdatlantik.co.uk//bcd-assets/specsheets/ds_a6t4gf3sacahpf_02.pdf Expected delivery time
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Product Details
General Description
DDR3 SDRAM modules are high-speed, CMOS dynamic random access memory modules that use internally configured 8-bank DDR3 SDRAM devices. DDR3 SDRAM modules use DDR architecture to achieve high-speed operation. DDR3 architecture is essentially an 8n-prefetch architecture with an interface designed to transfer two data words per clock cycle at the I/O pins. A single read or write access for the DDR3 SDRAM module effectively consists of a single 8n-bit-wide, one-clock-cycle data transfer at the internal DRAM core and eight corresponding nbit-wide, one-half-clock-cycle data transfers at the I/O pins. DDR3 modules use two sets of differential signals: DQS, DQS# to capture data and CK and CK# to capture commands, addresses, and control signals. Differential clocks and data strobes ensure exceptional noise immunity for these signals and provide precise crossing points to capture input signals.
Fly-By Topology
DDR3 modules use faster clock speeds than earlier DDR technologies, making signal quality more important than ever. For improved signal quality, the clock, control, command, and address buses have been routed in a fly-by topology, where each clock, control, command, and address pin on each DRAM is connected to a single trace and terminated (rather than a tree structure, where the termination is off the module near the connector). Inherent to fly-by topology, the timing skew between the clock and DQS signals can be easily accounted for by using the write-leveling feature of DDR3.
Serial Presence-Detect EEPROM Operation
The 2K-bit Serial Presence Detect (SPD) EEPROM is fully compatible to industrial standard I2C/SMBus interface and compliant to the JEDEC 42.4 specification. The EEPROM memory is organized as 256 x 8 bits. This is designed for memory module applications in most PC and Server platforms, as well as other related applications. The EEPROM operates from 1.7V to 3.6V and is offered in 8-pin Ultra-thin DFN package, 2 mm x 3 mm x 0.6 mm (max.), providing space as well as cost saving for DIMM manufactures.
One of the features is to permanently lock the data in its first half (lower) 128 bytes (address 00h to 7Fh). This feature is specifically designed for use in DRAM DIMM with SPD. All information concerning the DRAM module configuration (e.g. access speed, size, and organization) can be kept write-protected in the first half of the memory. The second half (upper) 128 bytes of the memory (address 80h to FFh) can’t be writeprotected using two different software write protection mechanisms. By sending a specified sequence to the device, the first 128 bytes memory can be write-protected either permanently or resettable.
4GB DDR3 SDRAM SODIMM Specifications
- Max. Speed: DDR3L-1866@CL=13
- Fast Data Transfer Rates: PC3-14900
- tCK(min): 1.07 ns
- CAS Latency (CL) (nCK): 13
- tRCD (nCK): 13
- tRP (nCK): 13
- Operating Temperature: 0C to +70C
Features
- DDR3L functionality and operations supported as defined in the component datasheet
- 204-pin, small-outline dual in-line memory module (SODIMM)
- 1Rx8 memory module (1 rank of x8 DDR3 SDRAMs)
- Power supply:
- VDD = 1.35 V (1.283-1.45 V)
- Backward compatible with VDD = 1.5 V (1.425-1.575 V)
- VDDSPD = 3.0 V to 3.6 V
- Nominal and dynamic on-die termination (ODT) for data, strobe, and mask signals
- On-board I2C serial presence-detect (SPD) EEPROM
- Fixed burst chop (BC) of 4 and burst length (BL) of 8 via the mode register set (MRS)
- Fly-by topology
- Gold edge contacts
- Terminated control command and address bus
- Module height: 1.181” (30.00 mm)